Title :
Mixed signal design and test education for high quality packaging development
Author :
Hamadi, Ihab ; Newman, Kimberly
Author_Institution :
Sch. of Eng. & Comput. Sci., Denver Univ., CO, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
As designers are pushing the limits of digital systems to achieve high-speed implementations, the need to combine digital and analog systems is becoming a high. priority. Mixed signal devices are becoming more wide spread in the area of telecommunication, where analog and digital components are combined on a single package to reduce product size and increase density. A mixed signal design for test approach needs to be maintained to insure the quality and reliability of these devices as they become more complex. This presentation will outline the development of an online course that addresses the area of mixed signal design and test through a review of the test protocols outlined with the IEEE 1149.4 standard, a description of the implementation of these approaches, and provide a preview of what is to come in the realm of mixed signal design and test.
Keywords :
IEEE standards; Internet; built-in self test; computer based training; design for testability; educational courses; electronic engineering education; integrated circuit packaging; mixed analogue-digital integrated circuits; BIST structures; IEEE 1149.4 standard; high quality packaging development; mixed signal design education; mixed signal design for test; mixed signal test education; online course; telecommunication; test protocols; web based modules; Circuit faults; Circuit testing; Costs; Digital integrated circuits; Electronic equipment testing; Integrated circuit testing; Packaging; Signal design; Standards development; System testing;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008309