Studies on thermal and mechanical properties of PBGA substrate and material construction

Ball grid array (BGA) package is an IC package for active devices intended for surface mount applications. It is an area array package, utilizing whole or part of the device footprint for interconnections between IC chip and printed circuits board [PCB]. The ball grid array packages increases electronic I/O counts significantly. Hence, the BGA package was mainly used in computer IT, telecommunication equipment, hand-phone, PDA as well as portable handhold electronic application. BGA packaging consisted in plastic substrate, which is to provide interconnection and mechanical platform. Substrate performance plays an important part in IC package reliability. The common quality issue and reliability issues of BGA package are delamination [popcorn], crack, warpage. All these failures are related to base material [substrate] mechanical and thermal properties. Hence, understanding and studying substrate material properties are becoming a key to development and design of an advanced electronic package. In this study, three different plastic substrates - BT, PPE and FR5 - were tested by TGA, TMA in order to obtain their mechanical, thermal behavior.