DocumentCode
1699155
Title
Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints
Author
Fan, S.H. ; Chan, Y.C.
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1605
Lastpage
1612
Abstract
The effect of misalignment on the electrical properties of anisotropic conductive film (ACF) joints is investigated in this work. It is found that along with the increase of misalignment, the connection resistance of ACF joints increases. When the misalignment in the x-direction is less than 5 μm, the increase rate of connection resistance is quite large. Then, along with the severity of misalignment, the increase rate becomes smaller. Finally, when the misalignment is close to 20 μm, the increase rate rises again. The Holm´s electric contact theory is used for understanding the connection resistance variation. On the other hand, with the increase of misalignment in the x-direction, the insulation resistance between ACF joints decreases. If the misalignment exceeded 10 μm, the decrease is prominent for the Ni particle ACF joints. This phenomenon can be explained by the effect of dielectric damage of the epoxy. The mathematical models are developed to calculate the variation of the probability of open and shorting after misalignment and predicate the maximum misalignment tolerance.
Keywords
adhesives; conducting materials; fine-pitch technology; flip-chip devices; surface mount technology; 5 to 20 micron; Holm´s electric contact theory; anisotropic conductive adhesive joints; connection resistance; dielectric damage; electrical characteristics; epoxy; fine pitch technology; flip chip devices; insulation resistance; mathematical models; misalignment; open; shorting; surface mount technology; tolerance; Anisotropic conductive films; Anisotropic magnetoresistance; Assembly; Conducting materials; Conductive adhesives; Electric resistance; Electric variables; Flip chip; Shape; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008321
Filename
1008321
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