Title :
Optocoupler BGA package
Author :
Joshi, R. ; Wu, Chung-Lin ; Narayanan, M.
Author_Institution :
Fairchild Semicond. Corp., San Jose, CA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
The article presents the design of an optocoupler BGA. A low profile miniature surface mount component is described up to 1.20 mm in height having a footprint smaller than the current PDIP form factors. The optocoupler BGA does not need encapsulation (mold compounds) and its manufacturing tooling is form factor independent. Its design also lends itself to improved reliability performance in accelerated tests such as thermal cycling. Using Pb-free solder balls an all Pb-free package can be constructed.
Keywords :
ball grid arrays; life testing; opto-isolators; reliability; soldering; surface mount technology; 1.20 mm; Pb-free solder ball; accelerated testing; manufacturing process; optocoupler BGA package; reliability; surface mount component; thermal cycling; Electronic components; Electronic packaging thermal management; Electronics packaging; Electrons; Integrated circuit packaging; Light emitting diodes; Manufacturing; Photodetectors; Phototransistors; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008334
