DocumentCode
1699552
Title
Novel hydrothermal processing (<100°C) of ceramic-polymer composites for integral capacitor applications
Author
Balaraman, Devarajan ; Raj, P. Markondeya ; Bhattacharya, Swapan ; Tummala, Rao R.
Author_Institution
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1699
Lastpage
1703
Abstract
Synthesis of high K thin films via low cost low temperature process remains a major challenge in realizing integral capacitors for SOP applications. The current study explores synthesis of Barium Titanate by Hydrothermal process. BaTiO3 films using hydrothermal synthesis at temperatures less than 100°C has been reported previously. However, these films are typically porous and hence give a very low dielectric constant and low yield. Precursor films are hence heat-treated and densified at temperatures higher than 300°C to obtain a good yield and hence a high dielectric constant which makes these processes incompatible with organic based build-up processes. Hence the process was modified to infiltrate a polymer into these porous films to improve the yield, reliability and subsequent processing of these films. BaTiO3 films were also synthesized on Titanium foils with the goal of integrating them with the standard PWB processes. Dielectric constant of 700 and specific capacitances more than 1000 nF/cm2 have been achieved by this modified hydrothermal process. The microstructure of the film and the polymer infiltration can be optimized to synthesize reliable films with high dielectric constant and low loss tangent. Hence, the film morphology and thickness are being studied to optimize the processing conditions for reliable films.
Keywords
barium compounds; capacitors; composite materials; dielectric losses; dielectric thin films; permittivity; porous materials; 100 degC; BaTiO3; PWB processing; Ti; barium titanate; ceramic-polymer composite; dielectric constant; high-K dielectric thin film; hydrothermal synthesis; integral capacitor; loss tangent; microstructure; organic build-up process; polymer infiltration; porous film; reliability; specific capacitance; system-on-package; titanium foil; yield; Barium; Capacitors; Costs; Dielectric constant; High K dielectric materials; High-K gate dielectrics; Polymer films; Temperature; Titanium compounds; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008337
Filename
1008337
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