DocumentCode
1699570
Title
Experimental investigation and quantitative analysis of resistance variations and control in printed thick film resistors
Author
Cheng, P.L. ; Law, T.W. ; Liu, C.K. ; Chong, I.T. ; Lam, David C C
Author_Institution
Dept. of Mech. Eng., Hong Kong Univ. of Sci. &´´rechnology, China
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1704
Lastpage
1708
Abstract
Polymer Thick Film Resistors (PTFRs) are low cost resistors with a wide resistivity range. Its low processing temperature makes it a potential candidate in the application of embedded resistors in polymer substrates. The electrical resistance variation of these resistors is approximately ±10% after deposition and the resistors require additional trimming procedure to tune the resistances to meet specifications. This adds to the cost and complicates the fabrication process when the resistors are embedded. In this study, the influences of PTFRs geometries on the resistance tolerances were conducted. Results indicated that the accuracy of stencil printed resistors was markedly higher than the screen printed resistors. The screen printed resistor edge geometries were observed to be irregular under the microscope, and FEM analyses revealed that the resistance tolerances were associated with irregular edge geometry. Remedies to the variations were proposed and the relationship between resistance tolerances and aperture orientations was also outlined.
Keywords
finite element analysis; polymer films; thick film resistors; FEM analysis; aperture orientation; edge geometry; electrical resistivity; embedded resistor; fabrication process; optical microscopy; polymer substrate; polymer thick film resistor; quantitative analysis; resistance tolerance; resistance variation control; screen printing; stencil printing; trimming method; Conductivity; Costs; Electric resistance; Geometry; Polymer films; Resistors; Substrates; Temperature; Thick films; Thickness control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008338
Filename
1008338
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