Q-factor prediction and optimization of multilayer inductors for RF packaging microsystems using time domain techniques

Author

Bushyager, Nathan ; Davis, Mekita ; Dalton, Edan ; Laskar, Joy ; Tentzeris, Manos

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

1718

Lastpage

1721

Abstract

This paper presents methods using time domain electromagnetic modeling techniques to characterize passive devices in packaging structures. Particularly, the Q of a novel multilayer inductor is predicted. The inductor uses a "hollow ground plane" configuration to increase performance. The modeling techniques employed include dielectric loss modeling to accurately characterize the device. In addition, several optimizations are used in order to speed computation.

Keywords

Q-factor; dielectric losses; finite difference time-domain analysis; inductance; inductors; micromechanical devices; microwave devices; packaging; FDTD; Q-factor prediction; RF packaging microsystems; dielectric loss modeling; hollow ground plane configuration; multilayer inductor optimization; multilayer spiral inductor; packaging structures; passive devices; time domain electromagnetic modeling; Dielectric losses; Electromagnetic modeling; Finite difference methods; Inductors; Nonhomogeneous media; Packaging; Q factor; Radio frequency; Spirals; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008341

Filename

1008341