Solder joint shape and standoff height prediction and integration with FEA-based methodology for reliability evaluation

Author

Sidharth ; Blish, Richard ; Natekar, Devendra

Author_Institution

Adv. Micro Devices Inc., Sunnyvale, CA, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

1739

Lastpage

1744

Abstract

Solder joint fatigue failure is a common failure mechanism in semiconductor packages mounted on boards. The thermal expansion mismatch between the package and the board causes cyclic loading on the solder joints during temperature cycling. It is therefore important to model the solder joint shape and standoff height accurately to estimate the reliability of a solder joint assembly. This paper discusses details of solder shape prediction using the Surface Evolver tool and its validation with experimental data. A comparison with truncated sphere model is also provided. A strategy for importing Surface Evolver data into a finite element based reliability evaluation is outlined.

Keywords

circuit reliability; convergence of numerical methods; electronic engineering computing; fatigue; finite element analysis; packaging; printed circuits; soldering; ANSYS based FEA module; FEA-based methodology; Surface Evolver tool; board-mounted semiconductor packages; convergence; failure mechanism; finite element based reliability evaluation; reliability evaluation; solder joint assembly reliability; solder joint fatigue failure; solder joint shape prediction; solder joint standoff height prediction; temperature cycling; thermal expansion mismatch; truncated sphere model; Assembly; Failure analysis; Fatigue; Finite element methods; Semiconductor device packaging; Shape; Soldering; Temperature; Thermal expansion; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008345

Filename

1008345