Title :
Effects of floating heat spreader in high density BGA packages
Author :
Varadarajan, Vijay ; Kim, Bruce C. ; Han, Dae-Hyun
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.
Keywords :
CMOS digital integrated circuits; ball grid arrays; heat radiation; integrated circuit packaging; 0.5 MHz to 3 GHz; CMOS digital chips; ball grid array package; electrical radiation effects; fast switching CMOS inverter; floating heat spreader effects; ground planes; heat spreader configurations; high density BGA packages; power planes; signal integrity; signal planes; simulations; Eddy currents; Electromagnetic interference; Electromagnetic radiation; Frequency; Heat engines; Integrated circuit interconnections; Inverters; Packaging; Resistance heating; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008348
