• DocumentCode
    1699807
  • Title

    Comparison of global nonlinear models and “model-on-demand” estimation applied to identification of a RTP wafer reactor

  • Author

    Braun, M.W. ; Rivera, D.E. ; Stenman, A. ; Foslien, W.

  • Author_Institution
    Dept. of Chem. Bio & Mater. Eng., Arizona State Univ., Tempe, AZ, USA
  • Volume
    4
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    3950
  • Abstract
    “Model on demand” (MoD) simulation of the temperature dynamics in a simulated rapid thermal processing (RTP) reactor is compared against various types of global models (ARX, semiphysical, combined semiphysical with neural net). The identification data is generated from an m-level pseudo-random sequence input whose parameters are specified systematically using a priori information readily available to the engineer. The MoD estimator outperforms the ARX model and a two semi-physical models, while matching the performance of a combined semi-physical with neural net model. This makes MoD estimation an appealing alternative to global methods because of its reduced engineering effort and simplified a priori knowledge regarding model structure
  • Keywords
    identification; neural nets; process control; rapid thermal processing; sequences; ARX model; RTP wafer reactor; global models; global nonlinear models; m-level pseudo-random sequence input; model structure; model-on-demand estimation; neural net model; rapid thermal processing wafer reactor; reduced engineering effort; semiphysical model; temperature dynamics; Automatic control; Chemical technology; Inductors; Neural networks; Predictive models; Rapid thermal processing; Semiconductor device modeling; Semiconductor process modeling; State estimation; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Decision and Control, 1999. Proceedings of the 38th IEEE Conference on
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0191-2216
  • Print_ISBN
    0-7803-5250-5
  • Type

    conf

  • DOI
    10.1109/CDC.1999.827976
  • Filename
    827976