Title :
Solution space analysis of high speed interconnects for OC-192 applications
Author :
Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Iryami, F. ; Acquistapace, T.
Author_Institution :
Electron. Packaging Dept., Gintic Inst. of Manuf. Technol., Singapore
fDate :
6/24/1905 12:00:00 AM
Abstract :
This paper describes the application of a solution space analysis methodology to differential interconnects for FR-4 substrate material. Full-wave frequency domain electromagnetic simulations have been performed to analyse the impact of material properties and manufacturing tolerances on the performance of coupled and uncoupled differential interconnects. In addition, broadband characteristics were also extracted to analyse the signal performance across the wide frequency spectrum. Based on analysis of the simulated results, a design solution space was derived for coupled and uncoupled differential interconnects. This database can be used within the design flow to concurrently meet performance specifications and manufacturability for backplane applications.
Keywords :
copper; coupled transmission lines; frequency-domain analysis; interconnections; microstrip lines; packaging; simulation; tolerance analysis; Cu; FR-4 substrate material; OC-192 applications; backplane applications; broadband characteristics; coupled interconnects; design solution space; differential interconnects; frequency domain EM simulations; full-wave electromagnetic simulations; high speed interconnects; manufacturing tolerances; material properties; signal performance; solution space analysis methodology; uncoupled interconnects; Analytical models; Backplanes; Databases; Electromagnetic analysis; Electromagnetic coupling; Frequency domain analysis; Material properties; Performance analysis; Signal analysis; Virtual manufacturing;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008351
