Title :
Moving signals on and off chip
Author :
Rosenbaum, Elyse ; Hyeon-Min Bae ; Bhatia, K.S. ; Faust, A.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
Today, signals being transmitted on and off chip have frequency spectra extending to 10 GHz and beyond. The parasitic impedance associated with the package and ESD protection circuit can distort a signal and must be carefully managed. An overview of methods for parasitic impedance mitigation and codesign is provided.
Keywords :
distortion; electrostatic discharge; integrated circuit design; integrated circuit packaging; integrated circuit reliability; I/O circuit topology; IC codesign; chip package; frequency spectra; on and off chip; on-chip ESD protection circuit; parasitic impedance mitigation; signal distortion; signal transmission; Bonding; Electrostatic discharge; Frequency; Impedance; Inductance; Integrated circuit packaging; Pins; Protection; Reflection; Wires; ESD; IO;
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
DOI :
10.1109/CICC.2009.5280774
