• DocumentCode
    1701071
  • Title

    A 1-V 60-µW 16-channel interface chip for implantable neural recording

  • Author

    Liew, Wen-Sin ; Zou, Xiaodan ; Yao, Libin ; Lian, Yong

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2009
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    This paper presents a low-voltage low-power 16-channel interface chip dedicated for implantable neural signal recording. It consists of 16 front-end channels with tunable band-pass filtering and gain settings, multiplexed to a 10-bit SAR ADC for simultaneous recording. To comply with the implantation safety issue while maintaining comparable performance, the overall system is optimized to achieve low power dissipation and efficient power distribution among each individual blocks. A power efficient OTA topology is adopted in the front-end amplifier and a novel dual-capacitive-array SAR ADC is chosen to achieve better power efficiency. A prototype fabricated in a 0.35-mum CMOS technology achieves a NEF of 2.16 and THD of 0.53% at full output swing while providing output data rate of 16 kS/s per channel. The interface consumes 60.3-muW total power from a 1-V supply.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; band-pass filters; bioelectric phenomena; biomedical electronics; brain; data acquisition; lab-on-a-chip; neurophysiology; prosthetics; CMOS technology; SAR ADC; brain state dynamics; efficient power distribution; front-end amplifier; front-end channels; full out-put swing; gain settings; implantable neural recording; implantable neural signal recording; implantation safety issue; low-voltage low-power 16-channel interface chip; output data rate; power 60.3 muW; power dissipation; power efficient OTA topology; tunable band pass filtering; voltage 1 V; Band pass filters; CMOS technology; Circuits; Electronics packaging; Low voltage; Multiplexing; Power dissipation; Power distribution; Silicon; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280795
  • Filename
    5280795