DocumentCode :
170122
Title :
Shadow-scan design with low latency overhead and in-situ slack-time monitoring
Author :
Sarrazin, Sebastien ; Evain, Samuel ; Miro-Panades, Ivan ; Valentian, Alexandre ; Pajaniradja, Suresh ; de Barros Naviner, Lirida Alves ; Gherman, V.
Author_Institution :
LIST, CEA, Gif-sur-Yvette, France
fYear :
2014
fDate :
26-30 May 2014
Firstpage :
1
Lastpage :
6
Abstract :
Shadow-scan solutions are proposed in order to facilitate the implementation of faster scan flip-flops (FFs) with optional support for in-situ slack-time monitoring. These solutions can be applied to system FFs placed at the end of timing-critical paths while standard-scan cells are deployed in the rest of the system. Automated scan stitching and automated test pattern generation (ATPG) can be performed transparently with commercial tools. The generated test patterns cover not only the mission logic but also the monitoring infrastructure. The latency of itc´99 benchmark circuits could be reduced with up to 10% while the stuck-at fault coverage (FC) was preserved as compared to circuit versions with full standard-scan design. Limited variations in the number of test patterns were observed when support for in-situ slack-time monitoring was provided.
Keywords :
automatic test pattern generation; fault diagnosis; flip-flops; logic design; logic testing; ATPG; automated scan stitching; automated test pattern generation; faster scan flip-flops; in-situ slack-time monitoring; itc 99 benchmark circuits; low latency overhead; shadow-scan design; standard-scan cells; stuck-at fault coverage; timing-critical paths; Automatic test pattern generation; Benchmark testing; Circuit faults; Clocks; Latches; Logic gates; Monitoring; in-situ slack-time monitoring; latency overhead; online monitoring; scan design; shadow-scan; timing violations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium (ETS), 2014 19th IEEE European
Conference_Location :
Paderborn
Type :
conf
DOI :
10.1109/ETS.2014.6847801
Filename :
6847801
Link To Document :
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