Title :
Cell-aware experiences in a high-quality automotive test suite
Author :
Hapke, Friedrich ; Arnold, Rinaldo ; Beck, M. ; Baby, M. ; Straehle, S. ; Goncalves, J.F. ; Panait, A. ; Behr, R. ; Maugard, G. ; Prashanthi, A. ; Schloeffel, Juergen ; Redemund, Wilfried ; Glowatz, A. ; Fast, Anja ; Rajski, J.
Author_Institution :
Mentor Graphics, Hamburg, Germany
Abstract :
High quality is an absolute necessity for automotive designs. This paper describes an approach to improve the overall defect coverage for CMOS-based high quality automotive designs. We present results from a cell-aware (CA) characterization flow for 216 cells, the pattern generation flow for a 130nm smart power design, and high-volume production test results achieved after testing multimillion parts. The idea behind CA tests is to detect cell-internal (CI) bridges, opens, leaking and high resistive transistor defects which are undetected with state-of-the-art tests. The production test results have shown that the CA tests detect various failing parts during a first wafer sort test which still resulted into unique failing parts after a second wafer sort test done at a different temperature and with additional tests. The obtained results encouraged us to continue this work beyond this paper to run further experiments with the final goal to eliminate the stuck-at (SA) and transition delay (TR) test by simultaneously improving the quality with CA tests which are a superset of SA and TR tests.
Keywords :
CMOS integrated circuits; automotive components; power integrated circuits; CI bridges; CMOS-based high quality automotive designs; cell-aware experiences; cell-internal bridges; failing parts; high-quality automotive test suite; high-volume production test; pattern generation flow; resistive transistor defects; second wafer sort test; size 130 nm; smart power design; stuck-at test; transition delay test; Automatic test pattern generation; Automotive engineering; Integrated circuit modeling; Libraries; Logic gates; Production; Transistors;
Conference_Titel :
Test Symposium (ETS), 2014 19th IEEE European
Conference_Location :
Paderborn
DOI :
10.1109/ETS.2014.6847814