Title :
3D ICs and 3D systems
Author :
Rincon, Ann Marie ; Loke, Alvin
Author_Institution :
SMSC, USA
Abstract :
The papers in this session describe a wide variety of novel 3D techniques at the wafer level to the board and system levels.
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
DOI :
10.1109/CICC.2009.5280816
