• DocumentCode
    1701712
  • Title

    The prospect of 3D-IC

  • Author

    Wong, S. Simon ; El Gamal, Abbas

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2009
  • Firstpage
    445
  • Lastpage
    448
  • Abstract
    This paper illustrates the performance advantages of 3D integrated circuits with two specific examples, namely 3D-FPGA and 3D-SRAM. Through strategic modification of the architectures to take advantage of 3D, significant improvement in speed and reduction in power consumption can be achieved.
  • Keywords
    CMOS memory circuits; SRAM chips; field programmable gate arrays; integrated circuit technology; monolithic integrated circuits; 3D integrated circuits; 3D-FPGA; 3D-IC; 3D-SRAM; CMOS memory circuits; monolithic integrated circuits; power consumption reduction; Energy consumption; Three-dimensional integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280818
  • Filename
    5280818
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1701712