DocumentCode
1701816
Title
Topographic mapping of single-sweep evoked potentials as a picture of the spatio-temporal dynamics in the brain
Author
Liberati, Diego ; Cerutti, Sergio ; Comi, Giancarlo ; Locatelli, T.
Author_Institution
Dipartimento di Elettronica, Politecnico di Milano, Italy
fYear
1989
Firstpage
721
Abstract
The results from two methods combined to gain insight into the dynamic behavior obtained in response to a given stimulus are reported. Single-sweep optimal processing of evoked potentials is used to process the recorded signal from 16 electrodes on the skull in order to obtain single responses. The spatial interpolation of the filtered signals over the modeled cranial surface gives a pictorial color-coded mapping of the potential distribution estimated at every signal sample, without the need for synchronized averaging. A topographic mapping referred to the traditional average, to a single filtered evoked potential, and to the original recorded data, at the 178-ms latency corresponding to the P200 peak for median nerve somatosensory stimulation, is shown and discussed. The results shows that the method is effective for noninvasive monitoring during physiological or psychological tasks characterized by fast dynamics. It employs easy-to-use devices and simple clinical procedures
Keywords
brain; mechanoception; 178 ms; P200 peak; brain spatio-temporal dynamics; easy-to-use devices; fast dynamics; median nerve somatosensory stimulation; noninvasive monitoring; physiological tasks; pictorial color-coded mapping; potential distribution; psychological tasks; simple clinical procedures; single-sweep evoked potentials; single-sweep optimal processing; skull; synchronized averaging; topographic mapping; Biomedical monitoring; Cranial; Delay; Electrodes; Interpolation; Psychology; Signal mapping; Signal processing; Skull; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1989. Images of the Twenty-First Century., Proceedings of the Annual International Conference of the IEEE Engineering in
Conference_Location
Seattle, WA
Type
conf
DOI
10.1109/IEMBS.1989.95950
Filename
95950
Link To Document