Title :
Studies on elimination solutions of galvanic corrosion on microchip Al bondpads in wafer fabrication and assembly processes
Author_Institution :
Chartered Semicond. Mfg Ltd, Singapore, Singapore
Abstract :
Galvanic corrosion cause discolored bondpads or nonstick bondpads. Therefore, to improve the quality of microchip Al bondpad, it is essential to eliminate galvanic corrosion. In author´s previous papers, the theoretical model and characteristics of galvanic corrosion have been studied. In this paper, we study possible root causes and elimination solutions of galvanic corrosion on bondpads in wafer fab and assembly processes.
Keywords :
aluminium; corrosion; electromigration; failure analysis; galvanising; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; wafer bonding; assembly process; galvanic corrosion; microchip bondpads; nonstick bondpads; wafer fabrication; Aluminum alloys; Assembly; Copper; Corrosion; Fabrication; Galvanizing; Metallization; Sawing; Semiconductor device modeling; Wafer bonding;
Conference_Titel :
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN :
0-7803-8658-2
DOI :
10.1109/SMELEC.2004.1620841
