• DocumentCode
    1702252
  • Title

    Process integration and manufacturing issues

  • Author

    Jansen, Philippe ; Sunderland, David

  • Author_Institution
    IMEC, Belgium
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Ultra-high frequency applications, functional system integration, and regulatory material constraints drive new approaches for integration of heterogeneous technologies and packaging. This session discusses high-speed BiCMOS, lead-free package reliability, and process integration of high-voltage CMOS and 3D imagers.
  • Keywords
    BiCMOS integrated circuits; CMOS process; CMOS technology; Environmentally friendly manufacturing techniques; Frequency; Manufacturing processes; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280836
  • Filename
    5280836
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1702252