Title :
Process integration and manufacturing issues
Author :
Jansen, Philippe ; Sunderland, David
Author_Institution :
IMEC, Belgium
Abstract :
Ultra-high frequency applications, functional system integration, and regulatory material constraints drive new approaches for integration of heterogeneous technologies and packaging. This session discusses high-speed BiCMOS, lead-free package reliability, and process integration of high-voltage CMOS and 3D imagers.
Keywords :
BiCMOS integrated circuits; CMOS process; CMOS technology; Environmentally friendly manufacturing techniques; Frequency; Manufacturing processes; Packaging;
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
DOI :
10.1109/CICC.2009.5280836
