• DocumentCode
    1702324
  • Title

    The challenge of lead-free electronics for aerospace electronic systems

  • Author

    Condra, Lloyd W. ; Meschter, Stephan J. ; Pinsky, David A. ; Rafanelli, Anthony J.

  • Author_Institution
    Boeing, Seattle, WA, USA
  • fYear
    2009
  • Firstpage
    355
  • Lastpage
    362
  • Abstract
    Driven by legislation resulting from two European Union directives, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment in 2006. Although not generally affected directly by the legislation, the aerospace industry is being swept along as its electronics supply chain makes the transition which significantly impacts the design, production, and support of aerospace electronic systems. Because of its unique requirements such as long service lifetimes, reparability at the assembly level, rugged operating environments, and high consequences of failure, the aerospace industry must develop its own response to the challenges posed by lead-free electronics. This paper addresses some of these challenges: (1) structures and properties of the most common lead-free alloys; (2) testing and evaluation of lead-free alloys, (3) tin whiskers, and (4) some of the specific aerospace program concerns such as reliability, repair, and product support.
  • Keywords
    aerospace; aerospace components; aerospace testing; aerospace electronic systems; aerospace industry; failure; lead-free alloys; lead-free electronics; reparability; service lifetimes; tin whiskers; Aerospace electronics; Aerospace industry; Aerospace testing; Assembly; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Industrial electronics; Lead; Legislation; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280838
  • Filename
    5280838