Title :
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)
Abstract :
The following topics were dealt with. CSP/BGA; materials; flip-chip technologies; optical components; thin-film processes; thick-film processes; thermal management; packaging technology; failure analysis; MCM; modelling; and substrate technologies
Keywords :
ball grid arrays; chip scale packaging; failure analysis; flip-chip devices; multichip modules; thermal management (packaging); BGA; CSP; MCM; failure analysis; flip-chip technologies; materials; modelling; optical components; packaging technology; substrate technologies; thermal management; thick-film processes; thin-film processes;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704492
