• DocumentCode
    1703427
  • Title

    Development of the hybrid structure for the barrel module of the ATLAS silicon microstrip tracker

  • Author

    Kondo, T. ; Ikegami, Y. ; Akimoto, T. ; Hara, K. ; Iwata, Y. ; Kato, Y. ; Kohriki, T. ; Nakano, I. ; Ohsugi, T. ; Shimma, S. ; Takashima, R. ; Tanaka, R. ; Terada, S. ; Ujiie, N. ; Unno, Y.

  • Author_Institution
    IPNS, High Energy Accelerator Organ., Ibaraki, Japan
  • Volume
    1
  • fYear
    2001
  • Firstpage
    535
  • Abstract
    A novel hybrid structure for the barrel module of the ATLAS Semiconductor Tracker (SCT) is developed. The hybrid carries 12 bare readout chips totaling 1536 channels. A flexible copper-polyimide 4-layer lamination is used as a basic circuit. The circuit is re-enforced by two carbon-carbon bridges coated with Parylene polymer. The hybrid staffed by resistors, capacitors and pitch adaptors undergoes heat cycling and quality inspections. The hybrid after chip mounting and wire bonding is placed over the top and bottom sides of the module assembly with no direct contact to silicon sensors. Some twenty full-fledge modules with active silicon strip sensors were assembled Their electrical, mechanical as well as thermal performances of the module are proven to be excellent.
  • Keywords
    application specific integrated circuits; capacitors; nuclear electronics; particle calorimetry; position sensitive particle detectors; readout electronics; resistors; silicon radiation detectors; ASIC; ATLAS silicon microstrip tracker; LHC; Large Hadron Collider; Parylene polymer; SCT; Si; barrel module; capacitors; carbon-carbon bridges; chip mounting; electrical performance; electromagnetic calorimeter; flexible copper-polyimide 4-layer lamination; full-fledge modules; heat cycling; hybrid structure; mechanical performance; pitch adaptors; quality inspections; readout chips; resistors; thermal performance; wire bonding; Assembly; Bridge circuits; Capacitors; Flexible printed circuits; Lamination; Mechanical sensors; Microstrip; Polymer films; Resistors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2001 IEEE
  • ISSN
    1082-3654
  • Print_ISBN
    0-7803-7324-3
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2001.1008514
  • Filename
    1008514