DocumentCode
1703619
Title
A full chip integrated power and substrate noise analysis framework for mixed-signal SoC design
Author
Kosaka, Daisuke ; Bando, Yoji ; Yokomizo, Goichi ; Tsuboi, Kunihiko ; Li, Ying Shiun ; Lin, Shen ; Nagata, Makoto
Author_Institution
Dept. of Comput. Sci. & Syst. Eng., Kobe Univ., Kobe, Japan
fYear
2009
Firstpage
219
Lastpage
222
Abstract
A fully integrated framework of full-chip power and substrate noise analysis is discussed, featuring description of transistor-level custom circuits as dynamic noise sources, a high capacity solver for chip-level substrate coupling, and noise back annotation flow to transistors of sensitive circuits. Recursive evaluation of power current and operation timing under the presence of dynamic IR drop greatly improves the accuracy of analysis. A 90-nm CMOS chip was examined both by on-chip noise measurements and full-chip noise analysis.
Keywords
CMOS integrated circuits; integrated circuit design; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; CMOS chip; chip level substrate coupling; dynamic IR drop; full chip integrated power noise analysis; full chip noise analysis; high capacity solver; mixed-signal SoC design; noise back annotation; on chip noise measurements; operation timing; power current; sensitive circuits; size 90 nm; substrate noise analysis; transistor level custom circuit; Circuit noise; Coupling circuits; Noise measurement; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-4071-9
Electronic_ISBN
978-1-4244-4073-3
Type
conf
DOI
10.1109/CICC.2009.5280883
Filename
5280883
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