• DocumentCode
    1703619
  • Title

    A full chip integrated power and substrate noise analysis framework for mixed-signal SoC design

  • Author

    Kosaka, Daisuke ; Bando, Yoji ; Yokomizo, Goichi ; Tsuboi, Kunihiko ; Li, Ying Shiun ; Lin, Shen ; Nagata, Makoto

  • Author_Institution
    Dept. of Comput. Sci. & Syst. Eng., Kobe Univ., Kobe, Japan
  • fYear
    2009
  • Firstpage
    219
  • Lastpage
    222
  • Abstract
    A fully integrated framework of full-chip power and substrate noise analysis is discussed, featuring description of transistor-level custom circuits as dynamic noise sources, a high capacity solver for chip-level substrate coupling, and noise back annotation flow to transistors of sensitive circuits. Recursive evaluation of power current and operation timing under the presence of dynamic IR drop greatly improves the accuracy of analysis. A 90-nm CMOS chip was examined both by on-chip noise measurements and full-chip noise analysis.
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; CMOS chip; chip level substrate coupling; dynamic IR drop; full chip integrated power noise analysis; full chip noise analysis; high capacity solver; mixed-signal SoC design; noise back annotation; on chip noise measurements; operation timing; power current; sensitive circuits; size 90 nm; substrate noise analysis; transistor level custom circuit; Circuit noise; Coupling circuits; Noise measurement; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280883
  • Filename
    5280883