Title :
Processor with side-channel attack resistance
Author :
Jen-Wei Lee ; Szu-Chi Chung ; Hsie-Chia Chang ; Chen-Yi Lee
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Public-key cryptosystems (Fig. 3.3.1) have been widely developed for ensuring the security of information exchange in network communications, financial markets, private data storage, and personal identification devices. In contrast to the well-known RSA algorithm, elliptic curve cryptography (ECC) provides the same security level with a shorter key size. As specified in IEEE P1363 (Standard Specifications for Public Key Cryptography), ECC arithmetic is required to provide not only dual-field operations over GF(p) and GF(2m) but also arbitrary elliptic curves (EC) for different requirements, such as encryption, signature, and key exchange. In this paper, a solution supporting a 521b key size is proposed to accelerate the most time-critical elliptic curve scalar multiplication (ECSM). It computes multiple points KP = P + P + ... + P, where K is the private key and P is an EC point. In addition, side-channel attack resistance is implemented to prevent information leakage from simple power-analysis (SPA), differential power-analysis (DPA) [1], zero-value point (ZVP) [2], and doubling attacks [3].
Keywords :
microprocessor chips; public key cryptography; DPA; ECC; ECC arithmetic; ECSM; GF(2m); GF(p); IEEE P1363; RSA algorithm; SPA; ZVP; differential power-analysis; doubling attacks; elliptic curve cryptography; financial markets; information exchange security; network communications; personal identification devices; private data storage; processor chip; public-key cryptosystems; side-channel attack resistance; simple power-analysis; storage capacity 521 bit; time-critical elliptic curve scalar multiplication; zero-value point; Conferences; Correlation; Delays; Elliptic curve cryptography; Hardware; Program processors;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487632