Convex-corner undercutting on corrugated diaphragm

KOH process simulation etching of corrugated diaphragm with bossed structure on silicon (100) is presented with emphasis on convex corner behavior. The influence of the KOH etching temperature and concentration on the convex corner undercutting of corrugated diaphragm are observed. The convex corner behavior is analyzed based on the geometrical parameters and the new emergent high index silicon planes. It was found that the convex corner undercutting phenomena is significantly reduced at low etching temperature and high KOH concentration respectively.