DocumentCode
1704039
Title
Multilayer package modeling using the multi-resolution time domain technique
Author
Bushyager, N. ; Obatoyinbo, A. ; Tentzeris, M.M. ; Laskar, J.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
4
fYear
2001
Firstpage
806
Abstract
The multi-resolution time domain technique is applied to the modeling of multilayer packaging structures. In particular, the performance of a multilayer balun is evaluated using MRTD and the results are compared to those obtained using the FDTD technique as well as a commercial simulator. The abilities of MRTD to handle complex structures and as nonuniform cells are highlighted.
Keywords
baluns; modelling; packaging; time-domain analysis; wavelet transforms; MRTD; complex structures; modeling; multi-resolution time domain technique; multilayer balun; multilayer packaging structures; nonuniform cells; performance; wavelets; Coupling circuits; Finite difference methods; Frequency; Impedance matching; Nonhomogeneous media; Packaging; Spirals; Stripline; Time domain analysis; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2001. IEEE
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7070-8
Type
conf
DOI
10.1109/APS.2001.959587
Filename
959587
Link To Document