Title :
Bandwidth and power management of glueless 8-socket SPARC T5 system
Author :
Krishnaswamy, Venkatesh ; Dawei Huang ; Turullols, Sebastian ; Shin, Jinuk Luke
Author_Institution :
Oracle, Santa Clara, CA, USA
Abstract :
Continuous advancement in multicore and multi-threaded design requires optimized integration of hardware and software to address increasing bandwidth and power management challenges for high-end system designs. The next generation Oracle T-series systems utilizing the SPARC T5 processor address these challenges. These systems scale from one to eight sockets using a 1-hop glueless connection. The processor implements 16 8-threaded cores, an 8MB L3 cache, four on-chip memory controllers and two on-chip PCIE Gen 3 interfaces [1]. The 8-socket system comprises an unprecedented 1024 threads to deliver the highest thread count ever in any T-series system. The fully configured 8-socket T5 system supports DDR3-1066-based memory bandwidth, which reaches over 2.9TB/s, coherence bandwidth of 2+TB/s and PCI Gen 3 bandwidth with 256GB/s to deliver 5+TB/s throughput (Fig. 3.7.1).
Keywords :
cache storage; microprocessor chips; 1-hop glueless connection; DDR3-1066-based memory bandwidth; L3 cache; bandwidth management; bit rate 256 Gbit/s; glueless 8-socket SPARC T5 system; high-end system designs; multicore design; multithreaded design; next generation Oracle T-series systems; on-chip PCIE Gen 3 interfaces; on-chip memory controllers; power management; storage capacity 8 Mbit; Bandwidth; Computer architecture; Decision feedback equalizers; Hardware; Program processors; Sockets;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487636