• DocumentCode
    1704086
  • Title

    A 10th generation 16-core SPARC64 processor for mission-critical UNIX server

  • Author

    Kan, Ryuji ; Tanaka, T. ; Sugizaki, G. ; Nishiyama, R. ; Sakabayashi, S. ; Koyanagi, Yoshio ; Iwatsuki, R. ; Hayasaka, K. ; Uemura, Toshifumi ; Ito, G. ; Ozeki, Yasuyuki ; Adachi, H. ; Furuya, Keiichi ; Motokurumada, T.

  • Author_Institution
    Fujitsu, Kawasaki, Japan
  • fYear
    2013
  • Firstpage
    60
  • Lastpage
    61
  • Abstract
    The 10th generation SPARC64™ processor named SPARC64 X contains 3-billion transistors on a 588mm2 die fabricated in an enhanced 28nm high-κ metal-gate (HKMG) CMOS process, with 13 layers of copper interconnect with low-κ dielectrics. More stress control, SiGe improvement and S/D optimization achieve about 10% higher performance than the standard 28nm high performance (28HP) process. SPARC64 X runs at 3.0GHz and consists of 16 cores, shared 24MB level 2 (L2) cache, four channels of 1.6GHz DDR3 controller, two ports of PCIe Gen3 controller, and five ports of system interface controller. ccNUMA is adopted as its memory system, and a cache coherence control unit for multi-chip systems with up to 64 processors is integrated into L2 cache control circuitry for lower latency and reduced area and power consumption.
  • Keywords
    CMOS integrated circuits; Ge-Si alloys; high-k dielectric thin films; low-k dielectric thin films; microprocessor chips; semiconductor materials; 16-core SPARC64 processor; DDR3 controller; HKMG; L2 cache control circuitry; PCIe Gen3 controller; S/D optimization; SPARC64 X; SiGe; cache coherence control unit; ccNUMA; copper interconnect; frequency 1.6 GHz; frequency 3.0 GHz; high-κ metal-gate CMOS process; low-κ dielectrics; memory system; mission-critical UNIX server; multichip systems; power consumption; size 28 nm; storage capacity 24 Mbit; stress control; system interface controller; transistors; Backplanes; Decision feedback equalizers; Ground penetrating radar; Latches; Pipelines; Program processors; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487637
  • Filename
    6487637