Title :
CMOS scaling and beyond
Author :
Kikkawa, Takamaro ; Lai, Jordan
Author_Institution :
Hiroshima University, Japan
Abstract :
This session of exclusively invited papers covers a selection of wafer-level technology developments key to extending nanoscale CMOS. Specific topics are progress and outlook of lithography, copper interconnects, SOI-CMOS device architectures, and high-mobility channel CMOS technologies.
Keywords :
CMOS technology; Copper; Lithography; Paper technology;
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
DOI :
10.1109/CICC.2009.5280902
