• DocumentCode
    170419
  • Title

    Three-dimensional CFD modeling of local scour around bridge piers

  • Author

    Kaihua Chen ; Weibing Feng ; Liyuan Xu

  • Author_Institution
    Coll. of Coastal, Harbor & Offshore Eng., Hohai Univ., Nanjing, China
  • fYear
    2014
  • fDate
    16-18 May 2014
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    In recent years, sediment scour near bridge piers and abutment is a serious problem which cause nationwide concern because it has resulted in more bridge failures than other causes. After this question arose, more and more numerical analyses about this problem have been carried out. In this study, computational model simulations using a 3D Computational Fluid Dynamics (CFD) model were conducted to examine the mechanism of scour around one cylindrical pier, and then verified the scour results with the experiments carried out by D.L Liu from Dalian University of Technology. After that, the study about the local scour around side by side cylindrical piers and square shaped pier has been promoted. Subsequently, we studied the flow field, downwash motions, horseshoe vortices and vortex shading around the piers, and a detailed analyses of how these piers been damage and the equilibrium scour depth has been carried out.
  • Keywords
    bridges (structures); computational fluid dynamics; condition monitoring; failure analysis; foundations; structural engineering; vortices; 3D computational fluid dynamics; Dalian University of Technology; abutment; bridge piers; failures; horseshoe vortices; local scour; numerical analyses; side cylindrical piers; three-dimensional CFD modeling; vortex shading; Bridges; Computational fluid dynamics; Computational modeling; Numerical models; Predictive models; Shape; Solid modeling; CFD; FLOW3D; equilibrium scour depth; flow-wave interaction; pier scour; scour mechanism;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Progress in Informatics and Computing (PIC), 2014 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4799-2033-4
  • Type

    conf

  • DOI
    10.1109/PIC.2014.6972329
  • Filename
    6972329