DocumentCode
1704310
Title
A single-inductor 0.35µm CMOS energy-investing piezoelectric harvester
Author
Dongwon Kwon ; Rincon-Mora, Gabriel A.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2013
Firstpage
78
Lastpage
79
Abstract
Because miniaturized systems store little energy, their lifespans are often short. Fortunately, vibrations are consistent and abundant in many applications, so ambient kinetic energy can be a viable source. Vibrations induce the charges in piezoelectric transducers to build electrostatic forces that damp vibrations and convert kinetic energy into the electrical domain. The shunting switches and switched-inductor circuit of bridge rectifiers in [1-2] increase this output energy by extending the damping (i.e., harvesting) duration within a vibration cycle. Because the output voltages of bridge rectifiers clamp and limit the electrical damping forces built, switched-inductor converters in [3-4], whose damping voltages can exceed their rectified outputs, draw more power from vibrations. Still, electrical-mechanical coupling factors in tiny transducers are low, so electrical damping forces (i.e., voltages) remain weak. Investing energy into the transducer can increase this force, but unlike in [5-6], which demand multiple inductors and high-voltage sources, the system presented here invests energy with only one inductor at low voltages.
Keywords
CMOS integrated circuits; energy harvesting; inductors; piezoelectric transducers; switching convertors; vibrations; ambient kinetic energy; bridge rectifier clamp; damp vibrations; electrical damping forces; electrical domain; electrical-mechanical coupling factors; electrostatic forces; high-voltage sources; piezoelectric transducers; shunting switches; single-inductor CMOS energy-investing piezoelectric harvester; size 0.35 mum; switched-inductor circuit; switched-inductor converters; Damping; Inductors; Investment; Logic gates; Manganese; Switches; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-4515-6
Type
conf
DOI
10.1109/ISSCC.2013.6487645
Filename
6487645
Link To Document