DocumentCode :
1704461
Title :
A 1.8GHz linear CMOS power amplifier with supply-path switching scheme for WCDMA/LTE applications
Author :
Onizuka, Kohei ; Saigusa, S. ; Otaka, S.
Author_Institution :
Toshiba, Kawasaki, Japan
fYear :
2013
Firstpage :
90
Lastpage :
91
Abstract :
Low-cost CMOS PAs for mobile terminals have been a focus of attention in recent years. Self-contained, linear CMOS PAs are particularly attractive for smooth replacement of conventional compound semiconductor PA products. The main challenge concerning the linear CMOS PAs is to improve their power efficiency. Doherty PAs improve the average power efficiency by means of backoff efficiency boosting; however, their applicable carrier frequency range is narrow owing to the high-order output network. Supply modulation is another technique to improve the PA back-off efficiency. Although hybrid modulators have been studied for CMOS polar transmitters [1,2], none of them have satisfied full specs of modulation bandwidth and the output power for 4G cellular applications. The area overhead is also unacceptable for application to a self-contained linear PA. A class-G supply modulator relaxes the limitations by receiving external, discrete levels of supply voltages [3]. However, it still requires a costly extra DC-DC converter for multilevel supply voltages.
Keywords :
4G mobile communication; CMOS analogue integrated circuits; Long Term Evolution; UHF integrated circuits; UHF power amplifiers; code division multiple access; modulators; 4G cellular applications; CMOS polar transmitters; DC-DC converter; Doherty PA; WCDMA-LTE applications; area overhead; backoff efficiency boosting; class-G supply modulator; compound semiconductor PA products; frequency 1.8 GHz; high-order output network; hybrid modulators; linear CMOS power amplifier; low-cost CMOS PA; power efficiency; self-contained linear PA; supply-path switching scheme; CMOS integrated circuits; Modulation; Multiaccess communication; Power amplifiers; Power generation; Radio frequency; Spread spectrum communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4673-4515-6
Type :
conf
DOI :
10.1109/ISSCC.2013.6487650
Filename :
6487650
Link To Document :
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