• DocumentCode
    1704514
  • Title

    Lateral power MOSFET low-doped drain (LDD) misalignment test structure

  • Author

    Vitomirov, I.M. ; Seabridge, S.N. ; Raisanen, A.D. ; Tellier, T.

  • Author_Institution
    Xerox Corp., Webster, NY, USA
  • fYear
    1997
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    We have designed and evaluated an electrical test structure capable of detecting sub-micron shifts in the alignment of the Low-Doped Drain (LDD) region relative to the gate of a lateral power MOSFET. The test structure consists of four identical high-voltage transistors geometrically rotated in 90° increments relative to each other. Under suitable transistor biasing conditions, a shift in the position of the mask defining the edge of the LDD region is shown to produce a linear response in the IDS of the affected test transistors. The dependence of the transistor current on the LDD region length is then used to electrically monitor this critical mask alignment
  • Keywords
    MOS integrated circuits; field effect transistor switches; masks; power MOSFET; power integrated circuits; semiconductor device testing; electrical test structure; high-voltage transistors; lateral power MOSFET; linear response; low-doped drain region; mask misalignment; sub-micron shifts; transistor biasing conditions; transistor current; Electric variables measurement; Electrical resistance measurement; Ink; MOSFET circuits; Power MOSFET; Power integrated circuits; Power transistors; Printing; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-3243-1
  • Type

    conf

  • DOI
    10.1109/ICMTS.1997.589321
  • Filename
    589321