DocumentCode
1705447
Title
A 470mV 2.7mW feature extraction-accelerator for micro-autonomous vehicle navigation in 28nm CMOS
Author
Dongsuk Jeon ; Yejoong Kim ; Inhee Lee ; Zhengya Zhang ; Blaauw, D. ; Sylvester, Dennis
Author_Institution
Univ. of Michigan, Ann Arbor, MI, USA
fYear
2013
Firstpage
166
Lastpage
167
Abstract
This paper proposes a power-efficient speeded-up robust features (SURF) extraction accelerator targeted primarily for micro air vehicles (MAVs) with autonomous navigation (Fig. 9.7.1). Typical object recognition SoCs [4-6] employ an application-specific algorithm to choose specific regions of interest (ROIs) to reduce computation by focusing on a small portion of the image. However, this approach is not feasible in applications where the whole image must be analyzed, such as visual navigation that requires the extraction of general features to determine location or movement. In addition, multicore architectures need to run at high clock frequencies to meet high peak performance requirements and the power consumption of inter-core communication becomes prohibitive. Since feature extraction algorithms require significant memory accesses across a large area, parallelization in a multicore system requires costly high-bandwidth memories for massive intermediate data.
Keywords
CMOS integrated circuits; aircraft navigation; autonomous aerial vehicles; feature extraction; object recognition; space vehicle electronics; system-on-chip; CMOS technology; ROI; SURF extraction accelerator; application-specific algorithm; high-bandwidth memories; intercore communication; microautonomous vehicle navigation; multicore architectures; multicore system; object recognition SoC; power 2.7 mW; power consumption; power-efficient speeded-up robust feature extraction accelerator; regions of interest; size 28 nm; visual navigation; voltage 470 mV; Clocks; Feature extraction; Latches; Memory management; Navigation; Program processors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-4515-6
Type
conf
DOI
10.1109/ISSCC.2013.6487684
Filename
6487684
Link To Document