DocumentCode
1705608
Title
An alternative approach to measures the application of dispatching rule in the wafer foundry
Author
Chik, M.A. ; Ahmad, Ibrahim ; Jamaluddin, Md Yusoff
Author_Institution
Dept. of Electr., Electron. & Syst., Univ. Kebangsaan Malaysia, Selangor, Malaysia
fYear
2004
Abstract
This paper focusing on the method to measures the application of dispatching rule in the wafer foundry. This is because dispatching rule play a critical role to determine the success of higher throughput, minimum cycle time, corresponded to turn ration of the WIP level and meeting on time delivery. In the implementation, it uses Advanced Productivity Family (APF), commercial software that integrated with Manufacturing Execution System (MES) for algorithm computational to calculate the compliances of the dispatching rule that is applied in the wafer foundry manufacturing shop floor. From the literature review, it is believed that until now there is non-formal measurement is being done to measure the compliance of the dispatching rule due to wafer processing complexity. This result will help to measure 100% of the compliance of the dispatching rule for the success of the implementation of any dispatching system in any wafer fabrication facilities. This implementation has successfully implemented in the real wafer fabrication.
Keywords
electronics industry; goods dispatch data processing; production engineering computing; productivity; semiconductor device manufacture; WIP level; advanced productivity family; dispatching rule; higher throughput; manufacturing execution system; minimum cycle time; real time dispatch; time delivery; wafer foundry; Application software; Dispatching; Fabrication; Foundries; Manufacturing; Monitoring; Production systems; Productivity; Semiconductor device manufacture; Systems engineering and theory; Advanced productivity Family(APF); Manufacturing Execution (MES); Real Time Dispatch (RTD);
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN
0-7803-8658-2
Type
conf
DOI
10.1109/SMELEC.2004.1620968
Filename
1620968
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