• DocumentCode
    1705667
  • Title

    Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

  • Author

    Sallehl, Mohamed Mohd ; Ahmad, Ibrahim ; Jalar, A. ; Omar, Ghazali ; Abdullah, Siti Hajar ; Arshad, Mohd Khairuddin

  • Author_Institution
    Fac. of Eng. & Fac. of Sci. & Technol., Universiti Kebangsaan Malaysia, Selangor, Malaysia
  • fYear
    2004
  • Abstract
    This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.
  • Keywords
    Fourier transform spectroscopy; X-ray chemical analysis; contact angle; focused ion beam technology; optical microscopy; scanning electron microscopy; semiconductor device metallisation; soldering; surface morphology; surface tension; wetting; EDX; FIB; FTIR analysis; SEM; contact angle analysis; die top; elemental analysis; metallization; nonwetting problem; optical microscope; solderability problem; surface analysis; surface morphology; surface tension; Bonding; Electron optics; Electronics packaging; Metallization; Optical microscopy; Scanning electron microscopy; Semiconductor device packaging; Surface finishing; Surface morphology; Surface tension;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
  • Print_ISBN
    0-7803-8658-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2004.1620970
  • Filename
    1620970