DocumentCode
1705667
Title
Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top
Author
Sallehl, Mohamed Mohd ; Ahmad, Ibrahim ; Jalar, A. ; Omar, Ghazali ; Abdullah, Siti Hajar ; Arshad, Mohd Khairuddin
Author_Institution
Fac. of Eng. & Fac. of Sci. & Technol., Universiti Kebangsaan Malaysia, Selangor, Malaysia
fYear
2004
Abstract
This paper will be discussed some aspects of surface morphology and elemental analysis on the solderability problem which caused non-wetting on top of die metallization layer. In this study few good and bad fresh die will be investigated along with the bad die which have non-wetting at die top. The surface analysis techniques will be used such as optical microscope and SEM to observe surface morphology. EDX investigation being done to determine the elements presents on the samples surface. Further details information using FIB also been performed. Contact angle analysis to measure the surface tension onto related area and FTIR analysis as support techniques.
Keywords
Fourier transform spectroscopy; X-ray chemical analysis; contact angle; focused ion beam technology; optical microscopy; scanning electron microscopy; semiconductor device metallisation; soldering; surface morphology; surface tension; wetting; EDX; FIB; FTIR analysis; SEM; contact angle analysis; die top; elemental analysis; metallization; nonwetting problem; optical microscope; solderability problem; surface analysis; surface morphology; surface tension; Bonding; Electron optics; Electronics packaging; Metallization; Optical microscopy; Scanning electron microscopy; Semiconductor device packaging; Surface finishing; Surface morphology; Surface tension;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN
0-7803-8658-2
Type
conf
DOI
10.1109/SMELEC.2004.1620970
Filename
1620970
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