A plane wave model approach to understanding propagation in an intra-chip communication system

Author

Kihong Kim ; Bomstad, W. ; Kenneth, K.O.

Author_Institution

Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

Volume

2

fYear

2001

Firstpage

166

Abstract

To further understand and explain the characteristics of integrated antennas in silicon substrates, an intuitive plane wave model is proposed. The model has been validated by quantitatively explaining the location of dips in the antenna gain versus frequency plots when a glass layer is inserted between a silicon wafer and a metal chuck using the interference effect between two propagating waves. These also convincingly demonstrated that the signal coupling between integrated antennas is due to wave phenomena rather than simple R-C coupling. Experiments have been carried out to characterize integrated dipole antennas.

Keywords

dipole antennas; electromagnetic coupling; electromagnetic field theory; electromagnetic wave interference; microwave antennas; microwave integrated circuits; microwave propagation; silicon; substrates; R-C coupling; Si; integrated antennas; integrated circuits; intra-chip communication system; metal chuck; microwave propagation; plane wave model; propagating wave interference; signal coupling; silicon substrates; silicon wafer; wave phenomena; Antennas and propagation; Coupling circuits; Dielectric losses; Dipole antennas; Frequency; Integrated circuit modeling; Microwave propagation; Semiconductor device modeling; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2001. IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7070-8

Type

conf

DOI

10.1109/APS.2001.959649

Filename

959649