DocumentCode
1705818
Title
Optical signal injection for high-speed wafer level function test of integrated circuits
Author
Berger, Horst H. ; Sturm, Johannes ; Esfahani, Farzad ; Benedix, Alexander ; Von Aichberger, Susanne ; Muller, Bernt ; Hofacker, Karl-otto
Author_Institution
Inst. of Microelectron. & Solid State Electron., Tech. Univ. Berlin, Germany
fYear
1997
Firstpage
39
Lastpage
42
Abstract
Conventional needle probe techniques do not permit wafer level tests at frequencies above about 100 MHz. As an alternative to special probes like microwave strip lines optical inputs have been designed which have been shown to operate up to 800 MHz in 1.2 μm BiCMOS technology. They are process compatible and require an area less than that of a standard aluminum pad
Keywords
BiCMOS integrated circuits; failure analysis; integrated circuit testing; 1.2 micron; 100 to 800 MHz; BiCMOS technology; IC testing; area; failure localization; high-speed wafer level function test; optical signal injection; process compatible; wafer level tests; Aluminum; BiCMOS integrated circuits; Frequency; High speed optical techniques; Microwave technology; Needles; Optical design; Probes; Strips; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-3243-1
Type
conf
DOI
10.1109/ICMTS.1997.589326
Filename
589326
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