DocumentCode
1706398
Title
A fully integrated 60GHz CMOS transceiver chipset based on WiGig/IEEE802.11ad with built-in self calibration for mobile applications
Author
Tsukizawa, T. ; Shirakata, N. ; Morita, Takahito ; Tanaka, Kiyoshi ; Sato, Jun ; Morishita, Yu ; Kanemaru, M. ; Kitamura, R. ; Shima, Tal ; Nakatani, Takeshi ; Miyanaga, K. ; Urushihara, T. ; Yoshikawa, Hideki ; Sakamoto, Takanori ; Motozuka, H. ; Shiraka
Author_Institution
Panasonic, Yokohama, Japan
fYear
2013
Firstpage
230
Lastpage
231
Abstract
A 60GHz short-range wireless system offers new opportunities for achieving wireless high-definition video links and multi-Gb/s wireless data transfer. Recent works have realized a 60GHz transceiver by means of a cost-effective CMOS process [1-3], but using a 60GHz system in mobile terminals poses the difficult challenge of achieving low power consumption as well as small form factor. The publication [3] achieves a power consumption of less than 756mW, but uses a simple MAC protocol incompatible with global standards and also suffers from a limited distance of less than 4cm. This paper presents a fully integrated transceiver chipset based on WiGig/IEEE802.11ad standards targeting mobile usage. The chipset is developed for a single-carrier (SC) modulation, which is suitable for reduced power consumption as compared to using OFDM modulation. However, the SC modulation is sensitive to in-band amplitude variation, mainly made worse by the gain variation of analog circuits and multipath delay spread. In order to compensate for those gain variations, the proposed chipset employs built-in TX in-band calibration and an RX frequency domain equalizer (FDE). The proposed techniques can relax the requirement for high speed analog circuits, leading to less power consumption while minimizing the increase of hardware size.
Keywords
CMOS integrated circuits; OFDM modulation; access protocols; built-in self test; calibration; low-power electronics; millimetre wave integrated circuits; mobile radio; radio transceivers; wireless LAN; FDE; MAC protocol; OFDM modulation; RX frequency domain equalizer; SC modulation; TX in-band calibration; WiGig-IEEE 802.11; built-in self calibration; cost-effective process; form factor; frequency 60 GHz; fully integrated CMOS transceiver chipset; gain variations; global standards; hardware size minimization; high speed analog circuits; in-band amplitude variation; low power consumption; mobile applications; mobile terminals; mobile usage; multipath delay spread; short-range wireless system; single-carrier modulation; wireless data transfer; wireless high-definition video links; CMOS integrated circuits; Calibration; Modulation; Power demand; Radiofrequency integrated circuits; Transceivers; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-4515-6
Type
conf
DOI
10.1109/ISSCC.2013.6487712
Filename
6487712
Link To Document