DocumentCode
1706475
Title
X-ray laminographic application of lens-coupled CMOS detector for PCB inspection
Author
Kim, Ho Kyung ; Jeon, Sung Chae ; Cho, Gyuseong ; Lim, Seong-Hoon
Author_Institution
Dept. of Nucl. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Volume
3
fYear
2001
Firstpage
1620
Abstract
A lens-coupled CMOS detector has been tested for the application in X-ray laminography, which is a tomographic technique recently popular in the nondestructive inspection of printed circuit boards (PCBs). The lens-coupled CMOS detector is extremely cost-effective because of the simple configuration and the well-known CMOS technology. For the feasibility test, we have acquired X-ray images at various imaging conditions and analyzed them with respect to the system requirement. From the test results, although the projected image is reasonably acceptable to the normal nondestructive testing, it was concluded that the lens-coupling method is not appropriate to the laminography due to lowlight-collection efficiency. In this study, construction of the detector and its specification are described. Experimental results are reported with the discussion of the lens-coupling efficiency.
Keywords
CMOS image sensors; X-ray imaging; inspection; printed circuit manufacture; printed circuit testing; radiography; FPGA; PCB inspection; X-ray laminography; cost-effective detector; flat-panel imager; lens-coupled CMOS detector; low light-collection efficiency; nondestructive inspection; optimal design; tomographic technique; CMOS technology; Circuit testing; Inspection; Nondestructive testing; Printed circuits; System testing; Tomography; X-ray detection; X-ray detectors; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record, 2001 IEEE
ISSN
1082-3654
Print_ISBN
0-7803-7324-3
Type
conf
DOI
10.1109/NSSMIC.2001.1008651
Filename
1008651
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