DocumentCode :
170717
Title :
Hardware microprocessor thermal emulation using synthetic heat sources and temperature sensors in FPGA
Author :
Wojciechowski, Bartosz ; Nikodem, Maciej ; Weber, Piotr ; Zagrabski, Maciej ; Kepa, Krzysztof
Author_Institution :
Inst. of Comput. Eng., Control & Robot., Wroclaw Univ. of Technol., Wroclaw, Poland
fYear :
2014
fDate :
24-26 Sept. 2014
Firstpage :
1
Lastpage :
5
Abstract :
This work presents an early evaluation of FPGA-based hardware thermal emulation methodology based on artificial heat sources and temperature sensors that can be used in real-time thermal simulation infrastructure. Main functional blocks of a microprocessor are emulated as controllable heaters - blocks with resources configured for artificially high power dissipation. Based on power inputs from an architecture-level simulator the power dissipated by the heaters is adjusted and their temperature is measured by embedded thermal sensors based on ring oscillators (RO). This allows for real-time thermal emulation of future multi-core microprocessor systems considering long time constants of whole cooling packages and also effects such as thermal coupling between the cores.
Keywords :
cooling; electronics packaging; field programmable gate arrays; microprocessor chips; oscillators; temperature sensors; FPGA; architecture-level simulator; artificial heat sources; artificially high power dissipation; controllable heaters; cooling packages; embedded thermal sensors; hardware microprocessor thermal emulation; multi-core microprocessor systems; ring oscillators; synthetic heat sources; temperature sensors; thermal coupling; Field programmable gate arrays; Heating; Microprocessors; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
Conference_Location :
London
Type :
conf
DOI :
10.1109/THERMINIC.2014.6972481
Filename :
6972481
Link To Document :
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