Creation and use compact thermal models for virtual prototyping of electronic assemblies from a semiconductor companies perspective

Compact Thermal Models (CTMs) are now in use for more than 10 years. We have come a long way since the first introduction of the CTMs half way the nineties [1] [2]. This paper will give an overview of problems that still existed from the moment CTMs were introduced, how they were solved, and what must be done to make better use of this technology.