• DocumentCode
    170734
  • Title

    Requirements for the industrial automation of compact thermal model creation using CFD simulation

  • Author

    Blackmore, Byron ; Parry, John

  • Author_Institution
    Mentor Graphics, Halifax, NS, Canada
  • fYear
    2014
  • fDate
    24-26 Sept. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The generation of Compact Thermal Models (CTMs) for electronics packages with simulation tools has long been a task for thermal engineers. One of the challenges traditionally associated with this task is the engineering effort required to reliably create a high quality detailed simulation model of a package family and any design variants in a consistent manner. Implementation of an automated methodology to produce CTMs would introduce much efficiency to this process, freeing up valuable engineering expertise for higher value activities within the organization. Achieving such an automated workflow has however several pre-requisites. These are introduced and discussed in this paper, and illustrated by way of a case study.
  • Keywords
    computational fluid dynamics; electronics packaging; CFD simulation; automated methodology; compact thermal model creation; electronics packages; high quality detailed simulation model; industrial automation; package family; simulation tools; thermal engineers; Adaptation models; Automation; Computational modeling; Conferences; Data models; Load modeling; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2014.6972490
  • Filename
    6972490