• DocumentCode
    1707528
  • Title

    A digitally modulated 2.4GHz WLAN transmitter with integrated phase path and dynamic load modulation in 65nm CMOS

  • Author

    Lu Ye ; Jiashu Chen ; Lingkai Kong ; Cathelin, P. ; Alon, Elad ; Niknejad, A.

  • Author_Institution
    Univ. of California, Berkeley, Berkeley, CA, USA
  • fYear
    2013
  • Firstpage
    330
  • Lastpage
    331
  • Abstract
    In order to support higher throughputs, the power consumption of 2-to-5GHz Wi-Fi transmitters (TXs) has been continuously rising, and has hence become increasingly problematic for mobile devices. To extend battery life, the TX must be efficient not only at peak power but also at backoff, due to the use of high Peak-to-Average-Power-Ratio (PAPR) OFDM modulation. Many recent works have aimed to enhance PA efficiency at back-off powers [1-4], but relatively few have integrated these techniques into a complete TX system. For example, previous designs employing digital polar or outphasing architectures often realized phase modulation with off-chip instruments. Similarly, while good close-in spectral performance has been shown, far-out spectral images remain problematic for TXs where the PA itself is digitally modulated. Moreover, previous works often do not include overhead from components such as extra DC-DC converters (for multiple PA supplies) or did not implement on-chip matching networks (MN) and/or output baluns, all of which directly affect the overall efficiency of integrated CMOS PAs.
  • Keywords
    CMOS integrated circuits; DC-DC power convertors; OFDM modulation; radio transmitters; wireless LAN; DC-DC converter; OFDM modulation; PA supply; PAPR; Wi-Fi transmitter; battery life; close-in spectral performance; digitally modulated WLAN transmitter; dynamic load modulation; frequency 2 GHz to 5 GHz; integrated CMOS PA; integrated phase path; mobile device; on-chip matching network; peak-to-average-power-ratio; size 65 nm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487756
  • Filename
    6487756