Title :
Integrated circuits in communication equipment
Author :
Mitchell, John F. ; Hummel, Harry J.
Author_Institution :
Motorola, Inc., Chicago, Illinois
Keywords :
Communication equipment; Conducting materials; Conductors; Costs; Filters; Integrated circuit interconnections; Integrated circuit technology; Printing; Resistors; Thick films;
Conference_Titel :
Vehicular Technology Conference, 1967. 18th IEEE
DOI :
10.1109/VTC.1967.1621889
