DocumentCode :
1707878
Title :
An 82.4% efficiency package-bondwire-based four-phase fully integrated buck converter with flying capacitor for area reduction
Author :
Cheng Huang ; Mok, Philip K. T.
Author_Institution :
HKUST, Hong Kong, China
fYear :
2013
Firstpage :
362
Lastpage :
363
Abstract :
Multi-phase converters have become a topic of great interest due to the high output power capacity and output ripple cancellation effect. They are even more beneficial to nowadays high-frequency fully integrated converters with output capacitor integrated on-chip. As one of the dominant chip area consumers, reducing the size of the on-chip decoupling capacitors directly leads to cost down. It is reported that a 5× capacitor area reduction can be achieved with a four-phase converter compared to a single-phase one [1]. However, the penalty is obvious. Every extra phase comes with an inductor, which is also counted as cost and becomes more dominant with increase in the number of phases.
Keywords :
capacitors; inductors; integrated circuit bonding; integrated circuit packaging; power convertors; wires (electric); efficiency 82.4 percent; four-phase converter; high output power capacity; high-frequency fully integrated converter; inductor; multiphase converter; on-chip decoupling flying capacitor area reduction; output capacitor integrated on-chip; output ripple cancellation effect; package-bondwire-based four-phase fully integrated buck converter; single-phase converter; Calibration; Capacitors; Inductance; Inductors; Pulse width modulation; Switches; System-on-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4673-4515-6
Type :
conf
DOI :
10.1109/ISSCC.2013.6487770
Filename :
6487770
Link To Document :
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