Multi-port dynamic compact thermal models of nonlinear heat conduction

A previous approach for constructing dynamic compact thermal models of nonlinear heat diffusion in electronic components is extended from the single-port to the multi-port case. The approach maintains high levels of accuracy for small state-space dimensions of the model. It is also very efficient since it requires the solutions to a few linear heat diffusion problems in the frequency domain. The multi-port compact models exhibit similar structure as the single-port counterparts and can be used to accurately approximate not only the junction temperatures, but also the whole spatio-temporal temperature distribution within the electronic components.