• DocumentCode
    1708211
  • Title

    A new communication mechanism for enhanced embedded training system

  • Author

    Yoon, Kun Su ; Jo, Han Sang ; Bang, Keugyeol

  • Author_Institution
    Korea Aerosp. Ind., Ltd., Sacheon, South Korea
  • fYear
    2009
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    This paper proposes a new communication mechanism for enhanced embedded training system (ETS) using the embedded virtual avionics (EVA). In the proposed mechanism, EVA card is a point-to-point TCP/IP communication directly interfaced with mission computer (MC) not via MIL-STD 1553B card. To support real-time embedded training (ET), data messages such as air-to-air, air-to-ground weapons and targets are integrated. The test results of operating flight program (OFP) with system integration laboratory (SIL) show that the proposed mechanism using the integrated message is improved up to 8.2 times on average in transmission speed compared with the conventional mechanism. And it is not needed the checksum process because of including in TCP/IP packet structure. Thus, it leads to achieve reliable transmission to the real-time constraints, required by military applications. Also, low-cost ETS can implement because MIL-STD 1553B card is removed.
  • Keywords
    computer based training; embedded systems; military avionics; military computing; transport protocols; virtual reality; ETS; EVA; OFP; SIL; air-to-air weapons; air-to-ground weapons; communication mechanism; data messages; embedded virtual avionics; enhanced embedded training system; integrated message; mission computer; operating flight program; point-to-point TCP/IP communication; real-time embedded training; system integration laboratory; transmission speed; Aerospace electronics; Aerospace industry; Computational modeling; Costs; Industrial training; Military aircraft; Radar; System testing; TCPIP; Weapons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace & Electronics Conference (NAECON), Proceedings of the IEEE 2009 National
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    978-1-4244-4494-6
  • Electronic_ISBN
    978-1-4244-4495-3
  • Type

    conf

  • DOI
    10.1109/NAECON.2009.5426649
  • Filename
    5426649