• DocumentCode
    170824
  • Title

    Modeling of the effective thermal conductivity of sintered porous pastes

  • Author

    Ordonez-Miranda, Jose ; Hermens, Marrit ; Nikitin, Ivan ; Kouznetsova, Varvara G. ; Volz, Sebastian

  • Author_Institution
    Lab. d´Energetique Mol. et Macroscopique, Paris, France
  • fYear
    2014
  • fDate
    24-26 Sept. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The thermal conductivity of sintered porous pastes of metals is modelled, based on an analytical and a numerical approach. The first method arises from the differential effective medium theory and considers the air voids as ellipsoidal pores of different sizes, while second one is based on the finite element method to analyse the scanning-electron-microscope images of the paste cross sections. It is shown that the predictions of both approaches are consistent to each other for a sample of porous silver paste. Pancake-shaped pores are the main sources of reduction of the thermal conductivity of porous pastes, and they block the thermal conducting pathways more efficiently than spherical and cigar-shaped pores. The decrease of the thermal conductivity of the matrix due to the presence of pores can be minimized with spherical pores. The predictions of the proposed methodology could provide useful insights on the thermal behaviour of porous pastes.
  • Keywords
    finite element analysis; porous materials; scanning electron microscopy; silver; sintering; thermal conductivity; voids (solid); Ag; SEM; air voids; analytical approach; cigar-shaped pores; differential effective medium theory; effective thermal conductivity modeling; ellipsoidal pores; finite element method; numerical approach; pancake-shaped pores; paste cross sections; porous silver paste; scanning-electron-microscope images; sintered porous pastes; spherical pores; Conductivity; Conferences; Finite element analysis; Shape; Silver; Thermal analysis; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2014.6972533
  • Filename
    6972533